Choosing Between IPC-6012 and IPC-A-600 Standards: A Dilemma Solved
## IPC-A-600: A Valuable Tool for Inspection and Understanding in Electronics Manufacturing
First published in 1982, IPC-A-600, now known as the **Acceptability of Printed Boards** document, is a standard developed by the Association Connecting Electronics Industries (IPC). This document provides visual illustrations of the requirements set forth in various printed board specifications, making it an invaluable tool for inspection purposes [1].
The contents of IPC-A-600 are in sync with the acceptability requirements expressed in IPC-6012D and IPC-6013C, ensuring a consistent understanding of what constitutes an acceptable printed circuit board (PCB) [2]. The current revision of IPC-600, IPC-A-600K, was published in July 2020 and covers a wide range of topics, including dielectric removal, back-drilled structures, voiding and fill, microvia contact dimensions, wicking, delamination, surface plating, etched and ink marking, via fills, hole registration, and automated inspection technology (AIT) [3].
IPC-A-600 serves as a useful tool for interpreting and understanding the results of automated inspection technology (AIT). AIT employs various methods such as Automated X-ray inspection (AXI), automatic optical inspection (AOI), automated solder paste inspection (SPI), automated laser test (ALT) measurements, and Machine vision (MV) method to evaluate several important dimensional characteristics of the board [4].
By setting the level of acceptance criteria for each class of product, IPC-A-600 provides graphical illustrations of the ideal, admissible, and non-negotiable conditions that are externally or internally observable on PCBs. This makes it a practical and accessible tool for manufacturers, helping them to ensure the quality and reliability of their products [5].
Some examples of features that are scrutinized using IPC-A-600 include final PCB thickness, hole characteristics, solderability, dielectric thickness & solder mask errors, existence of copper voids, annular rings requirements, drill breakouts, surface/subsurface imperfections, anomalies in conductive circuitry, and more [6].
In addition to IPC-A-600, IPC develops and maintains various other standards for the design, manufacturing, quality, and reliability of PCBs and electronic assemblies. For instance, IPC-6012 is a specification that establishes performance and qualification requirements for the fabrication of rigid boards [7]. IPC-6012 provides the performance criteria, while IPC-A-600 simply provides the visual illustrations of those requirements, showing examples of acceptable and rejectable versions of those requirements [8].
IPC-6012 covers requirements related to dielectric materials and foils, board dimensions, conductor widths/thicknesses/surfaces, structural integrity, hole/vias plating thickness, surface plating and surface finish coating criteria, solder mask coverage/thickness/curing specification, cleanliness, electrical, mechanical, and environmental parameters, thermal stress testing, and quality assurance provisions [9]. IPC-6012ES (2020) addendum provides class 3 requirements for space and military applications, while IPC-6012EA (2021) addendum contains specifications for rigid circuit boards used in the automotive industry [10].
IPC-6012E is the latest revision of the IPC-6012 specification, published in March 2020. IPC-6012 addresses the standards for medical-grade PCBs, and IPC-6012EM (2020) is a separate document that focuses on these standards [11]. IPC-9121 is a troubleshooting guideline that discusses problems, causes, and possible corrective actions related to printed board fabrication processes [12].
IPC's role extends beyond standard-setting and includes supporting technological advancements, facilitating collaboration across the electronics manufacturing sector, and addressing supply chain challenges. For instance, IPC has been instrumental in codifying best practices for Surface Mount Technology (SMT) and PCB assembly, which have become central to modern electronics manufacturing [3]. The organization's standards have supported the evolution of SMT from niche prototyping to mainstream manufacturing.
In conclusion, IPC-A-600, along with other IPC standards, plays a crucial role in ensuring the quality and reliability of PCBs and electronic assemblies. Its visual interpretations of the requirements set forth in various printed board specifications make it an essential tool for manufacturers, helping them to maintain consistency and compatibility across the industry.
The document IPC-A-600,Acceptability of Printed Boards, aligns with the acceptability requirements in IPC-6012D and IPC-6013C, limiting its focus on visual illustrations of those requirements. The visuals shown in IPC-A-600 help in interpreting the results of technology such as Automated Inspection Technology (AIT), including methods like Automated X-ray inspection (AXI), automatic optical inspection (AOI), automated solder paste inspection (SPI), automated laser test (ALT) measurements, and Machine vision (MV) method.
