Nova Ltd Unveils Nova WMC: Next-Gen Platform for Advanced Semiconductor Packaging
Nova Ltd has introduced the Nova WMC, a next-generation modular platform designed for advanced packaging applications in semiconductor manufacturing. This innovative tool is well-positioned to meet the evolving needs of 2.5D and 3D packaging processes, including hybrid bonding.
The Nova WMC addresses major challenges in semiconductor manufacturing, such as high warpage, non-symmetric shapes, and different surface conditions. It does so in a single tool, with high throughput and fast, repeatable scanning at nanometer fidelity.
Gaby Waisman, President and CEO of Nova Ltd, expressed excitement about the introduction of the Nova WMC to customers. The platform has already been adopted by a leading memory manufacturer for High Bandwidth Memory, with several additional orders placed by other manufacturers. The Nova WMC is a completely new proprietary system, designed from the ground up to provide exceptional versatility. It handles a wide range of wafer sizes and forms, and supports multiple metrology technologies.
The Nova WMC, Nova Ltd's latest optical metrology solution, is set to revolutionize semiconductor manufacturing. With its ability to handle diverse challenges and its high throughput, it is poised to become a crucial tool for manufacturers looking to advance their packaging processes.
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