showcasing eco-friendly AI cooling techniques at PTC 2025, taking place in Honolulu, by ZutaCore
ZutaCore, a leading innovator in the field of cooling technology, is set to showcase its groundbreaking HyperCool technology at the 2025 Pacific Telecommunications Council (PTC) in Honolulu, Hawaii. This event, taking place from January 19-22, is an excellent opportunity for attendees to learn more about HyperCool and its numerous benefits.
HyperCool is a waterless, two-phase, direct-to-chip cooling technology designed to manage the temperature of high-performance processors and AI GPUs, such as NVIDIA's Grace Blackwell superchip and the AMD Instinct MI300X. One of its key advantages is that it allows telecom providers to reuse the heat generated from AI factories for heating adjacent offices, data centre parts, or nearby buildings, such as schools and office buildings, as well as swimming pools.
The technology enables higher server densification in AI factories, consuming up to 50% less space than air-cooled data centres and up to 75% less space than immersion cooling. This not only reduces space consumption but also facilitates server densification, contributing to more efficient and effective operation of these facilities.
HyperCool offers 10-20% better energy efficiency compared to traditional cooling methods, with dynamic cooling, smaller pumps, and no performance degradation over time. The power savings from not using heat pumps in HyperCool can be redirected to the compute infrastructure, potentially generating more revenue for AI factories.
Moreover, since no water is used in the system, ZutaCore's HyperCool is free from corrosion and water-related threats such as mold and bio-growth. The heat transfer fluid in the HyperCool system never needs to be replaced, even after years of usage.
HyperCool's waterless, closed-loop two-phase cooling system operates without the need for facility water loops, reducing water consumption and enabling cooling in environments where water infrastructure is limited or unavailable. It can handle up to 240 kW of heat dissipation, cooling up to two 120 kW racks or four 60 kW racks, making it suitable for high-density racks and the industry's hottest processors, including next-generation AI GPUs.
HyperCool is a sidecar solution that integrates alongside existing air-cooled setups, allowing operators to extend current data centre investments and transition more rapidly to AI workloads without major infrastructure overhauls. It also features hot-swappable components for reliability and continuous operation, ensuring minimal downtime and high availability critical to telecommunications and data centre operations.
ZutaCore is part of the Open Compute Project (OCP) sidecar committee, contributing to standards that support both single-phase and two-phase cooling designs, assuring vendor neutrality and interoperability. Collaborations, such as with Compal, have demonstrated a partial Power Usage Effectiveness (PUE) as low as 1.01, which is about 5% more efficient than traditional cooling methods, contributing to lower operational costs and carbon footprint reductions.
In summary, ZutaCore's HyperCool technology provides scalable, energy-efficient, and reliable liquid cooling directly at the chip level without requiring water infrastructure. This innovation enables telecommunications providers and data centres to support high-power AI workloads effectively while reducing environmental impact and maximising existing assets. Attendees at the 2025 PTC in Honolulu will have the opportunity to learn more about this exciting technology and its potential to revolutionise the telecom and data centre industries.
[1] ZutaCore. (n.d.). HyperCool™ - The Next Generation of Liquid Cooling for Data Centers. Retrieved from https://www.zutacore.com/hypercool
[2] ZutaCore. (2021, November 2). ZutaCore Announces ZetaFrame® Configurable Cabinet Platform for AI and HPC Applications. Retrieved from https://www.zutacore.com/news/zutacore-announces-zetafra%C3%A8me-configurable-cabinet-platform-for-ai-and-hpc-applications
[3] ZutaCore. (2021, August 25). ZutaCore Announces HyperCool™, the Next Generation of Liquid Cooling for Data Centers. Retrieved from https://www.zutacore.com/news/zutacore-announces-hypercool-the-next-generation-of-liquid-cooling-for-data-centers
[4] ZutaCore. (2021, March 17). ZutaCore Announces $30 Million Series B Funding Round to Accelerate Adoption of its Liquid Cooling Solutions. Retrieved from https://www.zutacore.com/news/zutacore-announces-30-million-series-b-funding-round-to-accelerate-adoption-of-its-liquid-cooling-solutions
[5] Compal. (2021, July 9). Compal and ZutaCore Collaborate to Optimize Data Center Efficiency with HyperCool™ Technology. Retrieved from https://www.compal.com/en-us/news/compal-and-zutacore-collaborate-to-optimize-data-center-efficiency-with-hypercool-technology
- The waterless, two-phase, direct-to-chip HyperCool technology by ZutaCore, designed for cooling high-performance processors and AI GPUs, is set to address climate change by enabling the reuse of heat for heating buildings and reducing water consumption, thereby contributing to environmental science and data-and-cloud computing industries.
- At the 2025 Pacific Telecommunications Council (PTC) in Honolulu, ZutaCore will showcase HyperCool, a groundbreaking technology that offers energy efficiency improvements of up to 20%, increases server densification, and reduces carbon footprint, utilizing technology to create a sustainable future for the environmental-science, telecommunications, and data-center sectors.
